以热设计为核心的某功放一体化结构设计

Integral Structure Design of A Power Amplifier Based on Thermal Design

对某功放单元散热与结构设计问题进行了研究,阐述了该功放单元以热设计为核心结构设计思路,通过采用功放模块和电源模块分别固定在组合的散热器上的结构形式,实现了设备强迫抽风冷却设计;并采用Icepak软件仿真完成了功放单元热仿真。通过测试样机验证了该功放单元散热、结构一体化设计的有效可行性。

The heat dissipation and the structure design of a power amplifier were studied, the designing thought of taking thermal design as the core for the power amplifier was expounded. By adopting the structural form that power amplifier module and power supply module were independently fixed on bonded fin heat sinks, the forced air cooling system of the device was accomplished. The heat simulation of that power amplifier was achieved by software simulation of Icepak. The rationality of the integrated design of heat dissipation ＆ structure of the power amplifier was validated through testing the sample machine.