摘要
研究了Sn-3.5Ag-0.5Cu无铅焊料的力学性能与组织特征,结果表明焊料的应力应变关系表现出明显的温度和应变速率相关性,当温度升高,应变速率降低时,焊料的强度极限均会减小,但强度极限与温度和应变速率之间呈非线性相关;焊料在拉断前后,内部晶粒会与排列方式发生变化,且变形大小与加载的应变速率相关。
Discussed the mechanical properties and the structure character of the Sn-3.5Ag-0.5Cu lead-free solder and concluded that the solder stress-strain behavior puts up obvious relationship with temperature and strain-rate, when temperature raises or strain-rate reduces, the solder ultimate intensity reduces, but the relationships between ultimate intensity and temperature, strain-rate are nonlinear; before and after the solder is snapped, its crystal lattice array will change and the deformation depends on strain- rate.
出处
《电子工艺技术》
2015年第3期134-137,162,共5页
Electronics Process Technology
关键词
无铅焊料
力学性能
组织特征
Lead-free solder
Mechanical properties
Structure character
