合金点导致的双极产品低良失效及改善方法研究

Improvement Method Study on Low Yield Failure of Bipolar Product Induced by Alloy Dot in MCD Process

双极产品具有较多的优点,在很多领域都有广泛的应用。为提高电流的性能,需要在集电极下制作隐埋层,由隐埋层工艺异常导致的双极产品失效问题时有发生。详细介绍了双极产品发生低良失效问题,经过失效分析发现失效由锑源MCD涂布过程中产生的合金点导致,从失效机理进行了解释,经过工艺优化,减少了合金点的发生,为提高产品的良率提供了保证。

Bipolar product has much virtue and applies in many fields. Failure induced by process defect occurs sometimes. Bipolar product suffered from low yield failure. After FA analysis, alloy dot in MCD process has relationship to failure and the mechanism was studied. In order to improve yield, process will be optimized to reduce alloy dots.