摘要
通过外加恒定直流电压条件下的水滴试验,对热风整平焊料涂层电化学迁移现象进行观察。试验结果表明,树枝状电化学沉积物(枝晶)总是在阴极上生成,并向阳极生长。当外加电压不超过2 V时,试验时间内有枝晶生成,当电压大于8 V时由于气泡生成剧烈,难以生成搭接阴阳极的粗大枝晶。此外,伴随枝晶生发,有白色絮状沉淀物生成。
Electrochemical migration phenomena of hot air leveling solder coating were observed by water drop test under the condition of adding a constant direct current voltage. The results showed that the dendritic electrochemical deposition （dendrite） always generated on the cathode, and grow to the anode. When the applied voltage does not exceed 2 V, dendrite generated during test time; when the voltage is greater than 8 V, it was difficult to generate bulky dendrite lapping the cathode and anode due to bubbles generated intensely. In addition, white flocculent precipitate generated along with dendrite growth.
出处
《电子工艺技术》
2015年第3期150-153,共4页
Electronics Process Technology
关键词
电化学迁移
枝晶
热风整平
Electrochemical migration
Dendrite
Hot air leveling
