导电聚酰亚胺及其复合材料的研究进展

Research Progress of Conductive Polyimide and Its Composites

聚酰亚胺(polyimide,PI)广泛应用于航空航天、微电子、纳米、液晶、分离膜、激光等高新领域,提升其导电性能,使之更好地应用于电子工业,是当前的研究热点。介绍了原位聚合法、溶液混合法、表面改性自金属化法、离子注入法等制备PI导电复合材料的原理及其研究进展;概述了纳米金属物质、含碳纳米物质、结构性导电聚合物等导电填料的性能及在导电PI中的研究现状;简述了导电PI复合材料在集成电路、电磁屏蔽、导电膜剂、涂料等方面的应用状况。

The principle and progress of preparation of conductive polyimide composites with in-situ polymerization method, solution blending method, metalized surface modification method and ion implantation method are introduced. The performance of conductive filler of nano metal particles, carbonaceous material and structural conductive polymer are summarized, also with the current research situation. The application of conductive polyimide composites in microwave, electromagnetic shielding, electrostatic dispersion, integrated circuit, conductive film and coatings are briefly described.