摘要
Mo-Cu合金具有优良的导热、导电性能,与陶瓷基片良好匹配的热膨胀系数,被广泛用作热沉材料和电子封装材料。采用粉末冶金法制备了Mo-Cu合金材料,研究了烧结工艺对Mo-25Cu合金组织和性能的影响。结果表明,Mo-25Cu合金最佳烧结工艺为烧结温度1200℃和保温时间2h。合金的抗弯强度和硬度分别为554 MPa和56HRA,电阻率为3.7×10-8Ω·m,热导率为138 W·m-1·K-1。
Abstract Mo-Cu alloy with high thermal conductivity, good electrical conductivity and good matching of ce- ramic substrate is wildly used as heat sink material and electronic packaging materials. Mo-Cu alloy composite powders were prepared by powder metallurgy. The effects of sintering process on microstructure and properties of Mo-25Cu al- loy composite materials were researched. After sintered at 1200 ℃ for 2 h, the Mo-25Cu alloy obtained better sinte- ring density, bending strength, hardness, electrical resistivity, thermal conductivity, which were 7.41 g/cm3 , 554 MPa, 56HRA, 3. 7×10^-8Ω·m and 138 W ·m-1 ·K-1 , respectively.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2015年第10期97-99,共3页
Materials Reports
基金
湖北省自然科学基金(2014CFB627)
湖北省教育厅科学技术重点项目(D20141801)
关键词
烧结
性能
Mo-Cu, sintering, property
