聚酰胺酰亚胺与聚酯亚胺热固化机理的TGA法研究

Study the thermal curing mechanism of polyamide imide and polyester-imide by TGA

聚酰胺酰亚胺与聚酯亚胺材料拥有优异的机械性能、热性能、耐腐蚀性能及电绝缘性能,因而市场需求逐年增加.采用TG、RH、DMA、DSC等手段对聚酰胺酰亚胺与聚酯亚胺绝缘漆所成的膜进行表征,分析了其固化过程,结果表明:聚酰胺酰亚胺与聚酯亚胺的成膜固化过程是由溶液挥发的物理固化和扩链反应发生的化学固化两步反应构成;扩链反应是封端反应的逆过程并伴有扩链过程;成膜过程并没有发生交联固化反应,只是一种线性扩链固化成膜过程.

Material of polyamide-imide and polyester-imide have excellent mechanical properties,thermal properties, corrosion resistance and electrical insulation properties, thereby the demand increasing year by year. Using TG, RH, DMA, DSC to characterize the the formation mechanism of polyamide-imide and polyester-imide varnish, analysised the curing process. Results showed that：the film forming curing process of polyamide-imide and polyester-imide include two steps, one is the physical curing reaction by solution evaporation, the other is chemical curing reaction caused by the chain extension reaction; chain extension reaction is the reverse of the capping reaction accompanied chain extension process;cross-linking curing reaction does not occur in the film-forming curing process, cured film formation process is only a linear chain extend process.