摘要
低温共烧陶瓷(LTCC)技术可以实现真正意义上的三维微波互连基板,已经成为实现机载、星载、舰载相控阵雷达收/发组件小型化、轻量化、高性能、高可靠和低成本的理想方法之一。文中对基于国产钙硼硅系LTCC生瓷带微波基板制造技术进行了深入研究,剖析了影响基板外形尺寸和腔体翘曲度的工艺因素,提出了相应的解决方法。
LTCC provide the capability for true three-dimensional microwave interconnection substrates, and has become an ideal method for realizing small size, lightweight, high performance, high reliability and low-cost T/R modules for air-borne, satellite- borne and ship-borne phased array radars. In this paper, the manufacturing technology of microwave substrate based on national CaO-B2O3-SiO2 system LTCC green tape is studied, the technology factors which influence the substrate size and cavity warping are analyzed, and the relevant solutions are suggested.
出处
《现代雷达》
CSCD
北大核心
2015年第5期53-55,60,共4页
Modern Radar
