柔性复合层结构的仿真分析

Simulation and analysis of flexible composite layer structure

文中针对柔性电子中硅等无机脆性材料与柔软的弹性基底黏附形成的柔性复合层结构进行了力学分析。采用有限元软件建立了复合层结构分析模型,得到了该结构在弯矩作用下各层的应力应变分布信息,分析了PDMS层的应变隔离作用大小及其影响因素,为柔性电子结构的设计和优化提供了参考和借鉴。

In this paper, we carried out mechanical analysis of flexible composite layer structure ,which is combined by inorganic brittle materials such as the silicon and soft elastic substrate in flexible electronic. We established the composite layer analysis model by using the finite element software, and obtained the stress and strain distribution of each layer of the structure under bending moment, and analyzed the factors of strain isolation effect of PDMS layer and its influence. This work is able to provide references for the design and optimization of flexible electronic structure.