2Li Y,Wong C P. Recent advances of conductive adhesives as a lead-free Alterna- tive in electronic packaging. Materials, processing, reliability and application [J]. Materials Science and Engineering R Reports, 2006,51 (1/2/3) : 1-35.
9Princy K G, Joseph R, Kartha C S. 5tudies on conclucnve Sltlcone ruDDer wum- pounds[J]. Journal of Applied Polymer Science,1998,69(5); 1043-1050.
10Ajayi J D,Hepburn C. Electrical resistivity in carbon black filled silicone rubber [J]. Plastics and Rubber Processing and Applications, 1981,1(4):317-326.
8Soto-Oviedo M A, Arauja O A, Faez R,et al. Antistatic coating and electromagnetic shielding properties of a hybrid material based on polyaniline/organoclaynanocomposite and EPDM rubber [ J ]. Synthetic Metals, 2006, 156(18/19/20): 1249-1255.
9JOHN H L.Modeling and analysis of 96.5 Sn-3.5Ag lead-free solder joints of wafer lever chip scale package on buildup microvia printed circuit board[J].IEEE transactions on electronics packaging manufacturing, 2002, 25(1):51-56.
10DAOQIANG L.Conductivity mechanisms of ICAs.[J].IEEE.transactions on electronics packaging manufacturing, 1999,22(3):223-227.
