摘要
本文针对微电子组装中常见的BGA封装形式,对比采用三种不同成分的BGA焊球和焊膏组合(锡铅共晶焊球和锡铅共晶焊膏、Sn3Ag0.5Cu焊球和锡铅共晶焊膏、以及Sn3Ag0.5Cu焊球和Sn3Ag0.5Cu焊膏)焊接得到的BGA互连点,经过不同周期的热疲劳试验后,在金相显微镜和电子背散射衍射下观察,发现Sn3Ag0.5Cu焊球和锡铅共晶焊膏混装形成的BGA焊点中黑色的富锡相均匀弥散分布在焊球内,在热循环载荷作用下极难形成再结晶,抗热疲劳性能最好。
Based onthe common BGA package in microelectronics assembly,compared with the three different components of the BGA solder ball and solder paste composition（Sn Pb eutectic solder ball and lead tin eutectic solder paste,solder ball and Sn3Ag0.5Cu eutectic tin lead solder paste,solder ball and Sn3Ag0.5Cu welding and Sn3Ag0.5Cu welding of BGA interconnection paste）get the point,after the thermal fatigue test of different period,in the observation of metallographic microscope and electron backscatter diffraction, Sn3Ag0.5Cu solder ball and lead tin eutectic tin solder paste mixed black BGA formed in the solder joints are uniformly dispersed in the solder ball,under thermal cycle loading is extremely difficult to form recrystallization the best performance,thermal fatigue.
出处
《电子测试》
2015年第5期46-48,共3页
Electronic Test
基金
国防基础科研(项目编号:A1120132016)
关键词
BGA
热疲劳
再结晶
电子背散射衍射
BGA
thermal fatigue
recrystallization
electron backscatter diffraction
