摘要
目的研究了微量P元素的添加,对Sn-0.7Cu无铅钎料在高温条件下抗氧化性能的影响。方法制备了Sn-0.7Cu和Sn-0.7Cu-x P钎料合金,在250~370℃温度下,采用目测观察和表面刮渣法,研究了熔融钎料在高温下的抗氧化性能。结果微量P元素能显著提高熔融Sn-0.7Cu钎料低温下的抗氧化性能,低温下P含量为0.009%时抗氧化性能最好,当温度超过340℃时,抗氧化性能减弱,超过370℃时完全失去抗氧化效果。结论在250℃时,Sn-0.7Cu钎料的氧化膜生长系数k250℃=1.59×10-6,约为Sn-0.7Cu-0.009P的3倍,在370℃时,Sn-0.7Cu钎料的氧化膜生长系数k370℃=3.03×10^-6,与Sn-0.7Cu-0.009P的相差不大。
The aim of this study was to investigate the effects of adding trace P elements on the high-temperature oxi- dation resistance of Sn-0.7Cu lead-free solder. Sn-0.7Cu and Sn-0.7Cu-xP solder alloys were prepared to investigate the influence of trace P on liquid Sn-0.7Cu lead-free solder in the temperature range of 250 -370 ℃. The oxidation resistance at high temperature was evaluated by visual observation and surface skimming. The results showed that trace P could significantly improve the oxidation resistance of Sn-0.7Cu at low temperature and the optimal P content was 0.009%. The oxidation resistance was weakened when the temperature was higher than 340 ℃ and was completely lost when the temperature was over 370 ℃. The growth factor of oxide film on the surface of liquid Sn-0.7Cu solder （k250 ℃ = 1.59× 10^-4 ） was three times as high as that of Sn-0.7Cu-0.009P at 250 ℃, while the growth factor of oxide film on the surface of liquid Sn-0.7 Cu solder at 370 ℃ was very similar to that of the Sn-0.7Cu-0. 009P solder.
出处
《精密成形工程》
2015年第2期46-50,70,共6页
Journal of Netshape Forming Engineering
基金
重庆理工大学研究生创新基金重大项目(YCX2013101
YCX2014215)
重庆理工大学科研启动基金(2012ZD12)
重庆市教委/科技研究一般项目(KJ130813)
