摘要
目的制备一种新型低银亚共晶Sn-0.45Ag-0.68Cu-X(SAC-X)无铅钎料,并对其综合性能进行探究。方法参照国家标准,对其漫流性、润湿性及力学性能进行了测试,并与Sn-37Pb,Sn-0.7Cu,Sn-3.5Ag-0.6Cu钎料进行了对比。结果 4种钎料漫流性和润湿性大小依次为:Sn-37Pb,Sn-3.5Ag-0.6Cu,SAC-X,Sn-0.7Cu,其中SAC-X钎料铺展率达78.5%,润湿时间为1.3 s,最大润湿力为3.18 m N;SAC-X钎料抗拉强度(40 MPa)与高银Sn-3.5Ag-0.6Cu钎料(44 MPa)相差不大,但延伸率是高银Sn-3.5Ag-0.6Cu的1.89倍。结论低银SAC-X钎料综合性能优良,与Sn-3.5Ag-0.6Cu钎料相差不大。
A new type of low-silver hypoeutectic Sn-0.45Ag-0.68Cu-X （SAC-X） lead-free solder was prepared to in- vestigate its integrated performance. The flowing property, wettability and mechanical properties of the new type of solder were tested according to the national standards, and compared with those of Sn-37Pb, Sn-0.7Cu and Sn-3. SAg-0.6Cu solders. The flowing ability and the wettability of the four typical solders both followed the order of Sn-37Pb, Sn-3. SAg-0.6Cu, SAC-X and Sn-0.7Cu. The spreading rate of SAC-X solder reached 78.5% , the wetting time was 1.3 s, and the maximum wetting force was 3.18 mN. The tensile strength of SAC-X solder （40 MPa） was close to that of Sn- 3. SAg-0.6Cu solder （44 MPa）, but its elongation rate was 1.89 times that of Sn-3. SAg-0.6Cu solder. Low-silver SAC-X solder had good comprehensive performance, which was close to that of Sn-3.5Ag-0.6Cu solder.
出处
《精密成形工程》
2015年第2期51-54,65,共5页
Journal of Netshape Forming Engineering
基金
重庆理工大学研究生创新基金(YCX2013101
YCX2014215)
重庆理工大学科研启动基金(2012ZD12)
重庆市教委/科技研究一般项目(KJ130813)
关键词
低银SAC-X钎料
漫流性
润湿性
力学性能
low-silver SAC-X solder
flowing property
wettability
mechanical properties
