摘要
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度组装和互联的有效途径。文章研究了基于LTCC工艺的三维微波传输特性,设计了两种X波段三维结构功分器。利用高频仿真软件HFSS进行了建模仿真和性能优化,并加工了实物进行了测试。测试结果和设计结果性能吻合很好。
Low temperature co-fired ceramics（LTCC） become the efficient method which realize microwave device and electronic equipment to small ,light weight and high reliability. The article studied the 3D microwave transmission Character- isticbased on LTCC technology designed two kinds of X wave bands 3D structure power divider. Making use of the high fre- quency simulation software HFSS to carry on a model simulated and established. Testing result and design result function to fit together is very good.
出处
《空间电子技术》
2015年第2期6-8,共3页
Space Electronic Technology
关键词
LTCC
小型化
功分器
三维结构
Low temperature co-fired ceramics（LTCC）
Divider
3D structure
