一种硅微机械陀螺制造方法研究

A Manufacturing Method for Silicon Micro-machined Gyroscope

给出了一种硅微机械陀螺制造方法,该方法可适用于各种不同的微机电系统(MEMS)器件,包括加速度计、剪切应力传感器及MEMS光开关等。利用该方法制备了硅微机械陀螺,并给出了该陀螺的性能测试结果。同时分析了利用该方法制备各种不同器件时,工艺流程对器件性能的影响,重点讨论了硅-玻璃阳极键合、减薄工艺及深刻蚀所形成的侧壁质量,包括侧壁垂直度、侧壁杂质等因素对器件性能的影响。

This paper gives a method for manufacturing silicon micromechanical gyroscopes. The method can be applied to a variety of MEMS （Micro-Electro-Mechanical System） devices, including accelerometers, shear stress sensor, MEMS optical switch and so on. Using this method, silicon MEMS gyroscope is processed, and its performance testing results are presented. Meanwhile, the impacts of the process on device performance by using the method for manufacturing silicon micromechanical gyroscopes have also been analyzed. It focuses on silicon-glass anodic bonding, thinning process and deep etching process, which covers vertical sidewalls, degree sidewall impurities and other effects on the device performance.