摘要
选用酚醛树脂为固化剂,2-甲基咪唑为固化促进剂,制备了集成电路封装用环氧树脂模塑料。用非等温DSC法研究了固化促进剂用量对环氧模塑料的固化行为的影响,利用Kissinger方程、Crane方程和Ozawa方程计算出了环氧树脂模塑料的固化活化能、反应级数等固化反应动力学参数,推导出了固化过程的凝胶化温度、固化温度、后处理温度等最佳固化工艺条件,为环氧模塑料的配方优化和集成电路封装工艺的制定提供了基础数据。
The epoxy molding compound（EMC） for integrated circuits（IC） packaging was prepared by using phenolic resin as curing agent, 2-methylimidazole as curing accelerator, and the effect of curing accelerator addition amount on curing behavior of EMC was investigated by non-isothermal DSC method in this paper. Based on Kissinger method, Crane method and Ozawa method, the kinetic parameters such as activation energy and reaction order of EMC curing reaction were obtained. The characteristic temperatures of the curing process such as gel temperature, curing temperature and post-curing temperature were calculated by extrapolation. The results showed that the activation energy was reduced by increasing the amount of curing accelerator, which supplied the basic data for the recipe optimal of EMC and the determination of packaging technologies of IC.
出处
《合成材料老化与应用》
2015年第3期15-19,共5页
Synthetic Materials Aging and Application
基金
北京市科研基地-科技创新平台-新材料研究与开发项目(2013年度)
北京石油化工学院优秀责任教授和管理专家资助项目(2014年度)
关键词
集成电路
封装
环氧模塑料
固化动力学
integrated circuits（IC）, epoxy molding compounds（EMC）, non-isothermal curing kinetics
