机载电子设备搭接技术研究

Research on Bonding Technique of Onboard Electronic Equipment

针对机载电子设备装机时的搭接环节,对机箱主要搭接技术进行了研究。根据设备搭接目的和性能要求,给出了相应的设备-托架、托架-安装支架之间的搭接方法,模块-机柜、机柜-安装支架之间的搭接方法,以及设备的备份搭接方法,并指出了各种搭接方式的特点、优点和不足,为设备的研制和机上安装提供搭接技术支持。

The bonding technology for equipment installation onboard, as well as the method of secondary bonding was studied. According to the purposes and performance requirements for electrical bonding, the typical methods of bonding between equipment case-tray, tray-shelf, module-cabinet, cabinet-shelf were presented. The strongpoint and shortcoming of each methods of bonding were pointed out. This paper can provide a reference for bonding in equipment design and installation onboard.