期刊文献+

半导体器件贮存可靠性快速评价方法 被引量:4

Storage Reliability Assessment of Semiconductor Devices Based on Accelerated Life Test
下载PDF
导出
摘要 为解决复杂环境下半导体器件的贮存可靠性评估问题,结合半导体器件的贮存失效机理及其寿命-应力模型,提出了基于多贮存应力加速寿命试验的半导体器件贮存可靠性评估方法。在此基础上,以某款中频对数放大电路为研究对象,通过对加速寿命试验结果的分析,获得了电路在规定贮存时间下的可靠度。 For semiconductor devices applied in complicated circumstance, it is difficult to assess the storage reliability by using traditional reliability analysis method. Aiming at this problem, a new storage estimation method for semiconductor devices was proposed based on multiple-stress accelerated test degradation test. The storage reliability of a certain type of intermediate frequency logarithmic amplifier under specific working condition was obtained by analyzing the results of designed test.
出处 《微电子学》 CAS CSCD 北大核心 2015年第3期387-390,共4页 Microelectronics
基金 模拟集成电路重点实验室基金资助项目(9140C090406120C09037)
关键词 半导体器件 加速寿命试验 多贮存应力 贮存可靠性 Semiconductor device Accelerated life test Multiple-stress Storage reliability
  • 相关文献

参考文献4

  • 1Peck D S. Comprehensive model for humidity testing correlation [C] // Reliab Phys Symp. Anaheim, CA, USA. 1986: 44-50.
  • 2MANSON S. Thermal stress and low-cycle fatigue [M]. New York : McGraw-Hill, 1966.
  • 3罗俊,向培胜,赵胜雷,王毅,刘涛,陈光炳.半导体器件的长期贮存失效机理及加速模型[J].微电子学,2013,43(4):558-563. 被引量:5
  • 4JEP122G. Failure mechanisms and models for semiconductor devices [S].

二级参考文献13

  • 1GUNN J,CAMENGA R,MALIK S.Rapid assessment of the humidity dependence of IC failure modes by use of hast[C]// Proc IEEE Int Reliab Phys Symp.Phoenix,AZ,USA.1983:66-72.
  • 2STRINY K,SCHELLING A.Reliability evaluation of aluminum-metallized MOS dynamic RAM's in plastic packages in high humidity and temperature environments[J].IEEE Trans Compon,Hybr and Manufac Technol,1981,4(4):476-481.
  • 3PECK D.A comprehensive model for humidity testing correlation[C]//Proc IEEE Int Reliab Phys Symp.Anaheim,CA,USA.1986:44-50.
  • 4DUNN C,MCPHERSON J.Recent observations on VLSI bond pad corrosion kinetics[J].J Electrochem Soc,1988,135(3):661-665.
  • 5YUE J,FUSTEN W,TAYLOR R.Stress induced voids in aluminum interconnects during IC processing[C]// Proc IEEE Int Reliab Phys Symp.Orlando,FL,USA.1985:126-137.
  • 6MCPHERSON J,DUNN C.A model for stressinduced metal notching and voiding in very large-scaleintegrated A1-Si (1%) metallization[J].J Vac Sci & Technol B,1987,5(5):1321-1325.
  • 7OGAWA E T.Stress-induced voiding under vias connected to wide Cu metal leads[C]//Proc IEEE Int Reliab Phys Symp.Dallas,TX,USA.2002:312-321.
  • 8CHRISTIANSEN C.Effect of wire thickness on electromigration and stress migration lifetime of Cu[C]// IEEE Symp Phys and Fail Anal of Integr Circ.Singapore.2006:349-354.
  • 9COFFIN I F Jr.Low cycle fatigue[J].Materials Engineering Quarterly,1963,3(1):15-24.
  • 10MANSON S.Thermal stress and low-cycle fatigue[M].New York:McGraw-Hill,1966.

共引文献4

同被引文献42

引证文献4

二级引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部