真空烧结技术研究

Study on Technology of Vacuum Sintering

随着电子装备和系统对可靠性及使用期的要求不断提高,对于集成电路的质量和可靠性以及贮存寿命期提出了更高要求,因而对芯片的焊接工艺也提出了越来越高的要求。通过对清洗工艺和真空烧结工艺的深入研究,优化清洗工艺,改善焊料与金属化层的浸润性,优化芯片烧结工艺参数,包括选择合适的升温速率、烧结温度和焊料熔化时间及冷却方式等措施,改善了焊料的润湿性能,减小了空洞面积,提高了芯片焊接强度。

With the increasing requirements for reliability and service life of electronics egipment and systems,as well as the requirements for storage life of integrated circuits,are put forward in this paper.So more and more requests for the welding of chip craft are made.As the cleaning craft and vacuum sintering technology are deeply researched and the wettability of solder,the void area and the welding strength of chip are improved by the optimization of cleaning process,improving the solder infiltration with the metal layers,the optimization of the process parameters such as heating rate,sintering temperature,solder melting time and cooling method.