分割单元对电源/地平面输入阻抗影响的研究

Investigation on the impact of partition cell on input impedance of power and ground planes

研究了在多层印制电路板电源/地平面过孔周围布置具有桥接结构的蚀刻分割单元时过孔信号的返回路径阻抗及转移阻抗。分析了分割单元尺寸变化对返回路径阻抗的影响。采用二维边界元法进行了数值分析,并通过全波有限元分析软件进行了仿真验证。研究结果表明,在频率较高时,分割单元会激发较多的谐振峰值,返回路径阻抗大幅上升,但有助于降低噪声耦合。

The influences on return path impedance and transfer impedance of signal via were studied when the power and ground planes in multilayer print circuit board were arranged an etched partition cell with bridge connecting structure around via, furthermore, the impact from size variation of partition cell on return path impedance was analyzed. 2D boundary-element method was adopted for numerical analysis, and the results were verified by full wave finite-element method simulation software. The research results show that at high frequencies the partition eell excites more resonant peaks, therefore this increases the return path impedance significantly, whereas this is contributive to mitigate noise coupling.