Sn变质对AM60/6061液固复合界面组织和性能的影响

Effect of Mg Alloy Modified with Sn on Microstructure and Properties of AM60/6061 Liquid-solid Bonding Interface

研究了铝合金表面处理及Sn对镁合金变质处理对AM60/6061液固复合界面组织性能的影响。结果表明,铝合金表面处理可以有效改善AM60/6061液固复合的润湿性,使镁、铝合金之间形成良好的冶金结合。Sn对镁合金变质处理,可以改善AM60/6061液固复合界面的组织。随着Sn添加量的增大,弥散分布的Mg2Sn相可以有效细化界面组织,复合界面剪切强度明显提高,最大剪切强度达到32.7 MPa。当Sn添加量过大时,界面剪切强度则会下降。

Effects of pre-treatment of 6061Al substrate and Mg alloy modified with Sn on the AM60/6061 compound materials by liquid-solid bonding method were investigated.The results indicate that pre-treatment of the 6061Al substrate by replacing the natural oxide layer with a Zn coating can improve ef-fectively wettability of AM60/6061 liquid-solid compound materials,and desirable metallurgy bonding between Mg and Al substrate can be observed.The microstructure of compound samples can be refined with tin modified Mg alloy.With the increase of tin,Mg2 Sn is distributed dispersedly in the reaction layer,which can improve effectively the interface structure and shear strength.The shear strength rea-ches a peak value of 32.7 MPa with 1% tin.However,with tin addition more than 1% ,shearing strength of the compound materials is decliend.