摘要
A novel Zn-based high-temperature solder was developed to join copper/steel at moderate temperature. The effects of Bi and rare earth metal on the microstructures , wettability of solders as well as the mechanical properties of solder joints were investigated. The results indicated that with the addition of Bi into Zn-Cu-Sn （ZCS） alloy, significant improvement in wettability is realized. When the content of Bi element is 1.5 wt. % in the solder, the spreading area researched over 200 mm^2. Furthermore, with the addition of RE, refined primary ε-CuZn5 phases were formed and the shear strength of the solder joint was largely improved.
A novel Zn-based high-temperature solder was developed to join copper/steel at moderate temperature. The effects of Bi and rare earth metal on the microstructures , wettability of solders as well as the mechanical properties of solder joints were investigated. The results indicated that with the addition of Bi into Zn-Cu-Sn （ZCS） alloy, significant improvement in wettability is realized. When the content of Bi element is 1.5 wt. % in the solder, the spreading area researched over 200 mm^2. Furthermore, with the addition of RE, refined primary ε-CuZn5 phases were formed and the shear strength of the solder joint was largely improved.
