基于Moldflow的薄壁注塑件翘曲优化分析

Warpage optimization and analysis of thin-wall injection molding based on Moldflow

为减小注塑件的翘曲,降低模具设计过程中试模、修模的次数,以中兴牌路由器前盖为分析对象,首先利用UG软件对路由器前盖进行三维造型,再利用Moldflow软件对路由器前盖的翘曲缺陷进行分析.通过优化模具结构、制件厚度以及调整模具温度、注塑温度和保压曲线等工艺参数,使注塑件翘曲量减小.通过优化注塑件的成型过程减小翘曲量,得到最优的工艺数据组合,可进一步改善产品质量,降低模具设计制造成本.

In order to reduce the warpage of injection molding and the number of mould testing and repairing,the front cover of ZTE router was used for the analysis object.A solid model of the front cover was created by UG,Moldflow was used for the front cover to do warpage analysis.The warpage was reduced through optimizing the mold structure,the thickness of the plastic injection parts and adjusting the technological paramete such as die temperature,injection temperature,and presure maintaining line.The best optimized parameters are obtained by optimizing the injection molding process,which can reduce the warpage of the injection molding.It is important to the improvement of product quality and cost reduction.