摘要
文章归纳了提高集成式IGBT功率组件集成度的3种技术手段,包括新型散热设计、新型封装与互联,以及驱动与控制高度集成。对现有技术流派分类剖析,探讨了集成式IGBT功率组件的发展趋势,涉及高智能化与PEBB模块化设计。
It summarized three technical methods that could improve the integration level of integrated IGBT power assembly, which included the novel thermal design, packaging and interconnection and driver control circuit integration. The current technology classification was analyzed. Furthermore, the development trends of IGBT power assembly were discussed, including high intelligent design and PEBB module design.
出处
《大功率变流技术》
2015年第3期1-5,共5页
HIGH POWER CONVERTER TECHNOLOGY
关键词
IGBT
功率组件
集成
互联
散热
电力电子集成模块
智能化模块
IGBT
power assembly
integration
interconnection
heat radiation
IPEM（integrated power electronics module）
intelligent module
