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温度与镀层对Sn-0.7Cu焊料合金润湿性的影响 被引量：2

Wetting of Sn-0.7Cu Solder Alloy on Different Substrates at Different Temperatures
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摘要 主要研究了真空状态下,焊接温度为530,560和590 K时,Sn-0.7Cu焊料合金在镀Cu、镀Ni、镀Ni/Ag和镀Ni/Au基板上的润湿性.结果表明:提高钎焊时的焊接温度,有助于降低液态Sn-0.7Cu焊料合金的表面张力,从而增大Sn-0.7Cu焊料合金在焊接基板上的润湿性.在相同的焊接条件下,Sn-0.7Cu焊料合金在镀Ni/Ag和镀Ni/Au基板上的润湿性比其在Cu和镀Ni基板上的润湿性好. In this paper, the wettability of Sn-0.7Cu solder alloy was investigated on different substrates（Cu, Cu/Ni, Cu/Ni/Au and Cu/Ni/Ag）at different temperatures （530 K, 560 K and 590 K respectively）. The results show that the wettability of Sn-0.7Cu solder alloy improved due to the increase of reflowing temperature which decreased surface tension of molten Sn-0.7Cu alloy. In addition, in the same soldering conditions Sn-0.7Cu solder alloy had better wettability on Cu/Ni/Au and Cu/Ni/Ag substrates than that on Cu and Cu/Ni substrates.
作者 赵玉萍 霍飞
机构地区 通标标准技术服务(上海)有限公司
出处 《上海有色金属》 CAS 2015年第2期65-70,共6页 Shanghai Nonferrous Metals
关键词 Sn-0.7Cu焊料合金 表面张力 润湿性 Sn-0. 7Cu solder alloy surface tension wettability
分类号 TG425.1 [金属学及工艺—焊接]
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参考文献24

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上海有色金属
2015年 第2期

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