基于微波多层印制技术的20分路器设计与实现

Study and Implementation of 20 Divider Based on Microwave Multilayer Technique

利用微波多层印制技术,设计了一款工作于L频段的内埋小型化超宽带20分路器,并对其进行了加工和测试。测试结果表明:该功分器带内回波损耗优于20d B;插入损耗在16.8d B-17.8d B之间,并呈现出理想的线性衰减特性。该分路器具有优良的射频性能,且具有微波内埋结构,稳定性高,具有较强的实用价值。

An L-band embedded miniaturized 20 power divider with ultra-wideband is designed employing the multilayer microwave technique, while manufacturing and testing of the divider are also provided. The results indicate that the divider has a return loss better than 20 dB, and an insertion loss between 16.8 dB and 17.8dB, which also represents an ideal linearizing attenuation behavior. The proposed divider presents a good RF performance within an embedded structure, which would lead a high reliability; these characters show considerable value on practical applications.