水合抛光加工的运动学特性

Uniformity of Kinematic Trajectory in Hydration Polishing Process

建立了旋摆驱动方式下水合平面抛光过程中工件的运动学模型,揭示了抛光盘开孔方式对蓝宝石衬底的水合抛光均匀性影响规律。旋摆驱动条件下,杉木抛光盘的开孔方式对蓝宝石衬底水合抛光加工全局均匀性和局部均匀性具有重要的作用,局部均匀性的阶梯状分布为直线、圆环和螺旋线开孔方式的共性特征。与直线、圆环开孔方式相比,在一定的参数取值条件下,螺旋线开孔方式可更好地实现水合抛光加工的全局均匀性和局部均匀性要求。

Kinematic model for rotating and swing drive plane polishing process is deduced, effect of opening holes in the fir polishing plate on the uniformity during hydration polishing is revealed. Under the condition of rotating and swing drive plane polishing, distribution of opening holes have great effect on the global and local uniformity of sapphire substrates during hydration polishing. Same characteristics of line, circular and spiral holes are expressed as stepped straight for different areas of sapphire substrate. Compared with polishing plates with line and circular holes, spiral holes can achieve better global and local uniformity under certain conditions.