摘要
将铜粉做为导热填料通过混炼的方式填充到高强度的环氧基结构胶膜中,改善了结构胶膜的导热性能。重点研究了铜粉粒径和铜粉加入量对结构胶膜的力学性能和导热性能的影响。结果表明,树脂基体与400目铜粉质量比为1∶3时,结构胶膜热导率增加至5.1倍,室温剪切强度为30.3MPa,150℃剪切强度为8.5MPa,90°剥离强度为4.2N/mm。
In order to improve the thermal conductivity of structural adhesive film, the copper powder was added into the high-strength epoxy resin-based structural adhesive film as thermal conductive filler. The influence of particle size and quantity of copper powder on both the mechanical performance and thermal conductivity was investigated. The experimental results showed that when the mass ratio of resin matrix to copper powder was 1：3, the thermal conductivity coefficient of the thermal conductive adhesive film increased by 5.1 times, and its lap shear strength at room temperature and at 150℃ was measured to be 30.3MPa and 8.5MPa respectively, and its 90°peel strength was 4.2N/mm.
出处
《化学与粘合》
CAS
2015年第4期252-255,共4页
Chemistry and Adhesion
关键词
铜粉
结构胶膜
力学性能
热导率
Copper powder
structural adhesive film
mechanical property
thermal conductivity
