多吸嘴焊头机构固晶机设计

Design for a multi-nozzle die bonder bonding mechanism

LED固晶机是LED封装的重要设备,而焊头机构则是固晶机最重要的部分。基于Solid Works设计一种多吸嘴固晶机的焊头机构模型,能高速高精度运行。采用了多吸嘴焊头机构的设计,单次取晶固晶行程减少,且取晶固晶能同时进行,相比较于传统单吸嘴焊头机构的固晶机而言,其固晶速度大大提高。最后基于ADAMS软件对固晶机的吸嘴进行取晶固晶的接触力分析,其结果满足固晶的工艺要求。

LED die bonder is an important equipment of LED packaging production process, and the bonding mechanism is the most important parts of die bonder. In this paper, use Solid Works design model of a multi-nozzle bonding mechanism of die bonder, it can run at high speed and high precision. Because the use of a multi-nozzle bonding mechanism, in a single bonding cycle, the bonding travel reduced, also the pick operation and bond operation can complete at the same time. Compared to the traditional die bonder of single suction nozzle bonding mechanism, its bonding speeds is greatly improved. Finally, use ADAMS software to analyze the suction nozzle＇s contact force of picking and bonding, the results meet the bonding process requirements.