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孔电阻变异影响因素分析

Analysis and argument difference root cause of the PCB hole resistivity
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摘要 目前市场上越来越多的客户要求进行低电阻高绝缘的电子测试,这类PCB中,部分PCB线路不单是导线同时还是信号线,线路的阻值变化会造成信号的延滞和衰减,引发功能性问题。本文主要介绍了孔电阻的测试原理,通过对影响孔阻值变化的因素进行分析验证,并逐个分析论证,最终定位问题根源之所在。 On the market at present, more and more customers demands for low resistance and high insulation of electronic testing. For this kind of PCB, wire is not only part of the PCB line or signal lines, at the same time, line resistance changes will cause delay and attenuation of signals, cause functional problems. This article mainly introduced the hole resistance testing principle, made the analysis of factors influencing the resistance changes of hole, and analyzed one by one, finally located the root cause.
出处 《印制电路信息》 2015年第1期23-25,共3页 Printed Circuit Information
关键词 孔电阻 镀铜 减成法 Through Hole Resistance Copper Plating Subtractive Process
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