摘要
主要从HDI系统板板面露基材的几种情形进行原因分析,针对不同异常情形给出相应的改善方法及预防措施,重点强调铜箔质量问题引起的露基材问题,并给出了改善建议。
In this article, it mainly analyzed several cases for the exposed material of the HDI system board, according to different abnormal situation. The corresponding improving methods and preventive measures were presented, and some suggestions for improvement were given.
出处
《印制电路信息》
2015年第1期37-39,共3页
Printed Circuit Information
关键词
高密度互连系统印制板
板厚
铜结晶
孔囊
微蚀
HDI System PCB
Board Thickness
Copper Crystal
Hole Capsule
Micro Etching
