PCB板内短成因及其改善方法探讨

To investigate the causes of the PCB inner short circuit and method for improving

目前印制电路板的设计越来越趋向高密度发展,这给印制电路板的制造带来了诸多挑战,生产难度是越来越大,特别是多层板内层短路报废率高达1.08%,严重影响生产质量,大幅增加了多层板生产的品质报废成本。本文将针对多层板内短问题进行原因分析及改善方法探讨。

At present the design of the PCB is becoming more and more toward high density, which brings many challenges to the PCB manufacturing, and the production difficulty is bigger and bigger. The scrap rate is significantly higher, especially for the inner line scrap rate is as high as 1.08%, which seriously affected the production quality, greatly increased the quality of the multilayer production scrap costs. This article will perform causal analysis of laminated plate inner short problems and discuss the improving methods.