摘要
文章阐述了电解铜箔与压延铜箔的分类与特点,详细论述了两种铜箔的工艺流程和生产技术,给出了它们的具体要求和特性指标,指出了两种铜箔的技术与差异,描述了两种铜箔未来的发展趋势。
This paper expounds the classification and characteristics of electrolytic copper foil and rolled copper foil, makes detailed discussion on the technological process, production technology specific requirements and feature index of the two kinds of copper foil. It also points out the technology and difference, describes the future development trend of two kinds of copper foil.
出处
《印制电路信息》
2015年第2期13-20,63,共9页
Printed Circuit Information
关键词
电解铜箔
压延铜箔
技术差异
Electrolytic Copper Foil
Rolled Copper Foil
Technology Difference
