摘要
无卤中Tg覆铜板已成为主流的覆铜板产品,但市场对无卤高Tg高耐热覆铜板的期望也越来越强烈。本文制备了一种无卤高Tg高耐热覆铜板,该材料的Tg(DMA)>190℃,耐热性优异,Td(5%loss)>400℃,T300(带铜)>30min;并具有优异的粘结性能、优异的加工性能和低的CTE、极低的吸水率。
The mid-Tg halogen-free copper clad laminate（CCL） has become the popular product. The expectation for high Tg, high heat resistance CCL is growing strongly. In this paper, a halogen-free, high Tg and, high heat resistant CCL has been developed. This laminate reaches a Tg（DMA）〉190℃, has outstanding heat resistance with, Td（5% loss）〉400℃, T300（with copper） 〉30min, and shows high adhesion, good mechanical performance, low coefficient expansion and very low water absorption as well.
出处
《印制电路信息》
2015年第2期34-37,共4页
Printed Circuit Information
关键词
无卤
高Tg
高耐热
覆铜板
Halogen-Free
High Tg
High Heat Resistance
Copper Clad Laminate
