大背板层偏短路失效模式研究与对策

Research and countermeasure on inter-layer misregistration short circuit failure mode of large backplane

大背板在压合过程中个别芯板偏移,导致通孔金属化后与层偏层次短路,形成层偏。本文从层偏的影响因素、机理出发,分析出失效模式,然后采取各种有效的预防措施加以控制,针对内层、层压的各关键控制点进行分析跟进,解决层偏错位问题。提供了一套清晰完整的大背板层偏的控制方法,大大提高背板的一次合格率。

Large backplane is easily misregistered when laminated and resulted in short circuit. Based on the factors and mechanism, we took effective measures to prevent the failure mode of inter-layer misregistration and controlled key points in Inner Layer Imaging and Lamination. The results showed that the quantity of interlayer misregistration had been decreased and the first time quality of large backplane had been improved.