电镀填盲孔薄面铜化技术研究

Study on thin surface copper technology in blind via filling plating

为满足印制电路精细线路的设计,对制作设备、材料和工艺技术等提出了更高的要求,尤其是HDI印制板的薄面铜化工艺技术,对精细线路的制作有着十分重要的意义。文章将就电镀填盲孔薄面铜化工艺技术进行相关试验研究,得出在确保盲孔凹陷度小于15μm的前提下,电镀添加剂最佳组分配比,该条件下电镀层的厚度最薄,从而满足精细线路的制作要求。

In order to meet the needs of fine lines PCB, it requests higher requirements to equipment, materials and technology. Especially the thin surface copper has significance for the production of fine lines in HDI process technology in PCB. In this paper relative experiment research of thin surface copper in blind via filling plating process was made. It draw a conclusion that by ensuring the blind via dimple less then 15pm, making the best ratio of the electroplating additive and under the conditions of the thinnest plating thickness, we can meet the requirements of the laroduction of fine lines.