简析PCB制程中造成孔无铜的因素和改善

Simple analysis of factors and improvement of PCB process causing the hole without copper

文章主要分析了线路板中造成孔内铜空洞及无铜的产生原因,并从相关的设计源头、板材特性、层压结构、钻孔工艺、沉铜工艺以及干膜和电镀等的制程中简析其原理、原因,找出对应的改善、预防方案,提高良率,起到控制成本及提高品质的效果。

This paper mainly analyzes the reason caused the hole copper cavity and no copper circuit board and the source from the process design, related sheet properties, laminated structure, drilling process, copper precipitation process and the dry film and plating in the principle, reason etc. in order to find out the corresponding improvement, prevention programs to imprive the yield rate, control the cost and improve the quality of results.