CO_2激光直接成盲孔工艺探讨

A special panel of new technological process development

盲孔的制作是HDI板的关键性技术之一。本文就盲孔制作探讨一种CO2镭射激光直接成盲孔工艺以及影响点,用以提升盲孔与内层承接PAD对准度,优化盲孔孔型利于电镀制程生产,并精简流程、降低成本。

Blind hole making is one of the key technologies for HDI board. This paper made a blind hole of CO2 laser directly into the blind hole process, to enhance the blind hole and the inner layer to undertake PAD alignment, optimization of blind pass for electroplating process production, and to streamline the process, to reduce the cost.