环氧树脂及其固化剂对生物微胶囊性能的影响

Influence of epoxy resin and its curing agent on the properties of biomicrocapsule

以环氧树脂为壁材,制备一种含有孢子的生物微胶囊,其中环氧树脂分别用N-(β-氨乙基)-γ-氨丙基三甲氧基硅烷(KH-792)、间苯二甲胺(MXDA)和2,4,6-三(二甲胺基甲基)苯酚(DMP-30)进行固化.通过耐受性测试评价环氧树脂及其固化剂对孢子的生物相容性;通过平板菌落计数法研究微胶囊化后孢子的存活率;利用纳米压痕仪测试环氧壁材的弹性模量;通过三点弯曲测试壁材的抗折强度;利用扫描电子显微镜和光学显微镜观察环氧壁材及复合基体的断面形貌.结果表明,KH-792、MXDA、DMP-30和环氧树脂对孢子活性影响依次减小;由KH-792、MXDA和DMP-30固化的环氧树脂壁材断裂韧性依次降低,弹性模量依次增大.可知由DMP-30固化环氧树脂作壁材制备的生物微胶囊具有较高的孢子存活率和较好的力学触发性能.

Microcapsules containing spores were prepared by using epoxy resin as the shell material. The epoxy resin was cured with N-（amino-ethyl） -amino-propyl trimethoxy silane （KH-792） , M-Xylene Diamine （MXDA） and 2,4, 6-Tris （dimethylaminomethyl） phenol （DMP-30） , respectively. The influence of epoxy resin and its curing agent on the biocompatibility of spores were evaluated by the tolerance test method. The survival rate of microencapsulated spores was measured with the plate colony-counting method. The elastic modulus of epoxy wall was tested by a Nanoindenter. The flexural strength of the shell material was tested by the three-point bending method. The morphology of the composite matrix and the shell cross-section were characterized by a scanning electron microscope and an optical microscope. The results show that the influences of KH-792, MXDA, DMP-30 and epoxy resin on biologic activity of spores reduce in turn. KH-792, MXDA and DMP-30 respectively as the curing agent of the epoxy wall, in turn, reduce the fracture toughness while improve the elastic modulus. Therefore, the biomicrocapsules with shell materials of epoxy cured by DMP-30 show the highest rate of spores＇ survival and the best performance of mechanical trigger properties.