环氧树脂/聚酰胺体系固化工艺分析

Analysis on curing process of epoxy resin/polyamide system

利用差热分析仪对环氧树脂E51/聚酰胺650体系的固化反应过程进行测试。分析了固化剂添加量、改性剂种类及粉煤灰微珠对体系固化反应的影响。结果表明,固化促进剂和粉煤灰微珠会降低反应起始温度,促进反应进行;固化剂添加量和稀释剂等对固化温度影响较小。根据实验结果确定预固化温度为80℃,制备固化试样并进行DTA测试,由测试结果确定后固化温度为120℃。结合预固化温度和后固化温度制备不同的固化试样测试其红外谱线,并利用内标法计算环氧基面积表征固化度,最终确定最优固化制度为预固化温度80℃(120 min),后固化温度120℃(30 min)。

The DTA method was used to investigate the curing process of epoxy resin and polyamide system. Effects of the amount of curing agent / type of modifiers / cenosphere were studied. The result showed that curing promoter and cenosphere can promote the reaction and make the reaction temperature lower than before. The amount of curing agent and diluents have little effect on reaction temperature. According to the experimental results,we determine the pre-curing temperature was 80 ℃ and preparing the sample. Testing the curing sample and then decide the post-curing temperature was 120 ℃. Analysis the specimens made by different curing system by FT-IR and calculating the area of epoxy peak by internal standard method,determined the optimal curing system was pre-cured at 80 ℃( 120 min),post-cured at 120 ℃( 30 min).