摘要
对填充型环氧树脂基高导热材料的最新研究进展进行了总结,从导热机理、新型导热填料、构建完善有效的导热网络以及填料与环氧基体间界面层结构设计等方面进行了分析,提出了该研究领域的技术关键点和发展趋势。
The latest approaches to filled epoxy composites with high thermal conductivity were reviewed. The mechanism of thermal conduction, new type of thermal conductive fillers and the construction of the effective heat conducting network, as well as the design of interface layer between fillers and epoxy matrix were analyzed. Besides, the key techniques and hot research topics of high thermally conductive epoxy composites were summarized.
出处
《中国塑料》
CAS
CSCD
北大核心
2015年第7期13-19,共7页
China Plastics
关键词
环氧树脂
高导热
导热填料
界面层
导热网络
epoxy resin~ high thermal conductivity
thermally conductive filler
interface layer thermally conductive network
