期刊文献+

真空沸腾电沉积阴极计时电位和极间电阻研究

Research on cathode chronopotentiograms and interelectrode resistance during vacuum boiling electrodeposition
下载PDF
导出
摘要 为探索电解液真空沸腾电沉积工艺能显著改善沉积层表面质量和微观组织结构的原因,分析了电解液真空沸腾电沉积镍时的阴极电位和极间电阻与真空度、阴极温度等两个核心工艺参数间的关联特性。实验结果表明,阴极计时电位和极间电阻都严重受真空度与阴极温度影响,降低真空度和阴极面温度均会减小阴极计时电位,导致阴极极化度增大,从而改善沉积面表面质量和微观组织织构。 In order to explore the reason that the electrolyte vacuum boiling electrodeposition process can significantly improve the surface quality and microstructures of deposited layers. This paper mainly focused on analyzing the correlated characteristics between cathode potential,electrode resistance and vacuum degree,cathode temperature when electrolyte is vacuum boiling. Experimental results showed that: the vacuum degree and the cathode surface temperature can significantly affect the cathode chronopotentiometry and interelectrode resistance; decreasing the vacuum degree and the cathode surface temperature cause the cathode chronopotentiometry down,resulting in the cathode polarization degree increased,thereby improving the deposition surface quality and microstructure.
出处 《河南理工大学学报(自然科学版)》 CAS 北大核心 2015年第4期510-513,共4页 Journal of Henan Polytechnic University(Natural Science)
基金 国家自然科学基金资助项目(51175152) 河南省高校科技创新人才支持计划项目(2012HASTI012)
关键词 电解液真空沸腾电沉积 计时电位 极间电阻 液相传质 vacuum boiling electrodepositon chronopotentiometry interelectrode resistance mass transfer
  • 相关文献

参考文献11

  • 1WALTHER SCHWARACHER.Electrodeposition:A Technology for the Future[J].The Electrochemical Society Interface·Spring,2006:32-35.
  • 2SCHLESINGER M,PAUNOVI M.Modern Electroplating.5th ed.New Jersey:John Wiley&Sons Inc.,2010.
  • 3朱荻.真空排除气泡法电铸:中国,91108101.1[P].1991-07-21.
  • 4NAM S E,SEONG Y K,LEE J W,et at.Preparation of highly stable palladium alloy composite membranes for hydrogen separation[J].Desalination,2009,236:51-55.
  • 5明平美,姜无疾,郑建新,等.电解液真空沸腾式高速电沉积方法及装置:中国,201010198012.1[P].2010-06-11.
  • 6李英杰.电解液真空沸腾电沉积电极过程液相传质机理研究[D].焦作:河南理工大学,2011:67-79.
  • 7MING P M,LI Y J.Morphology and microhardness of nickel electroformed under vacuum-degassing conditions[J].Key Eng.Mat.,2011,455:495-498.
  • 8MING P M,LI Y J.Microstructure and properties of nickel prepared by electrolyte vacuum boiling electrodeposition[J].Surface and Coatings Technology,2012,213:299-306.
  • 9明平美,吕文星,李英杰,商静瑜,王俊涛.电解液真空表面沸腾高速电沉积技术[J].中国科学:技术科学,2013,43(9):1034-1043. 被引量:2
  • 10MING P M,LV W X,LIY J,et al.Electrodepositing Nickel under Electrolyte Reduced-pressure Boiling Condition[J].Electrochimica Acta,2014,120:6-15.

二级参考文献29

  • 1明平美,李英杰,李新华,秦歌,商静瑜.负压-温度梯度电沉积镍镀层的耐腐蚀性[J].稀有金属材料与工程,2012,41(S2):393-397. 被引量:1
  • 2明平美,姜无疾,郑建新,等.电解液真空沸腾式高速电沉积方法及装置:中国,201010198012.1[P].2010-10-27.
  • 3Schlesinger M, Paunovi M. Modem Electroplating. 5th ed. New Jersey: John Wiley & Sons Inc., 2010.
  • 4Schwarzacher W. Electrodeposition: A technology for the future. Interface, 2006, 15:32-35.
  • 5Tsai T H, Yang H, Chein R. New electroforming technology pressure aid for LIGA process. Microsyst Technol, 2004, 10:351-356.
  • 6Pessel L. Apparatus for electroplating metal. U.S. Patent: 2465747, Mar. 29, 1949.
  • 7Becker O A. Apparatus for electroplating metal surfaces, in particular cut edges formed by stacking sheet metal panels cut to size. U.S. Patent: 4081347, Mar. 28, 1978.
  • 8Muttilainen E, Tunturi P J. Hard chromium plating under reduced pressure. Technical Research Centre of Finland, 1983.
  • 9Anon. Surface-treatment process for hard chromium plating of steel bars. Anti Corros Methods Mat, 1986, 33:18.
  • 10Dini J W, Beat T G,Cowden W C, et al. Plating under reduced pressure. In: The Proceedings of the 79th AESF Annual Technical Conference. Atlanta: American Electroplaters and SurFace Finishers Society, 1992. 883-904.

共引文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部