添加Cu-Cr络合物的高分子聚合物的红外激光诱导表面金属化研究

Study on the surface metallization of Cu-Cr complexes-doped high molecular polymer induced by infrared laser

对添加Cu-Cr络合物的高分子聚合物红外激光诱导表面金属化进行了实验研究,利用1.06μm和10.60μm激光对材料进行表面改性处理,并通过多种表面检测方法对改性后的样品进行了分析。结果表明,1.06μm激光可使材料表面产生大量起到"锚固作用"的微孔,并且样品表面呈现周期性起伏结构,表面增附效果较强,1.064μm激光可打破Cu-Cr络合物的化学键,在改性区域出现还原性Cu1+和Cr3+,含量分别为0.9%和2.8%,激光处理后得到的镀层平均厚为1 100μm,标准差为0.29μm,且镀层附着力较大;而10.60μm激光处理后样品表面呈随机起伏结构,表面Cu1+和Cr3+的含量分别为0.4%和1.6%,镀层平均厚度为1.70μm,标准差为0.59μm,且镀层附着力较小。

The surface metallization of Cu-Cr complexes doped high molecular polymer induced by infrared laser is studied in this paper.The surface modifying process was accomplished by 1.06μm and 10.6μm infrared lasers,and the microstructure and the chemical properties of the modified areas are analyzed by many surface detection methods.The experimental results show that the ablation effect of the 1.064μm laser beam leads to the formation of a large number of holes,which plays the role of ＂anchoring＂ on the irradiated surface.The modified areas after irradiation by 1.06μm laser show a periodic structure,leading to an increased surface adhesive force.The 1.064μm laser beam can break the chemical bonds of the Cu-Cr complexes,resulting in the emergence of the reduction ions of Cu^1＋and Cr^3＋in the modified region,and the contents of the Cu^1＋and Cr^3＋ions are 0.9% and 2.8%,respectively.The average thickness and standard deviation of the deposited copper layer after irradiation by 1.064μm laser are 1100μm and 0.29μm,respectively.By contrast,a random fluctuated structure was formed after irradiation by10.60μm laser beam,and the contents of Cu^1＋and Cr^3＋ions are 0.4%and 1.6%,respectively.The average thickness and standard deviation of the deposited copper layer after irradiation by10.6μm laser are 1.7μm and 0.59μm,respectively,and the adhesive force of the copper layer is lowerthan that irradiated at 1.060μm.