微互连技术的研究现状

Research Status of Micro Interconnect Technology

电子封装技术的发展决定了半导体技术的发展水平。微互连技术是电子封装技术的重要组成部分。论文阐述了近几十年来微互连技术的发展路径以及成就,着重研究了低温低压固态互连技术的发展现状。

The development of electronic packaging technology determines the development level of semiconductor technology. Micro in-terconnect technology is an important part of electronic packaging technology. In this paper, the development path and achievements of mi-cro interconnection in recent decades are introduced, and the development of the technology of low temperature and low voltage solid-state interconnect is emphatically studied..