1Sheu G J, Hwu F S, Tu S H et al. The heat dissipation performance of LED applied a MHP [ C ]. Fourth international conference on solid state lighting, Proceedings of SPIE,2005,5941:594113.1 - 8.
2Lai Y, Cordero N. Thermal management of bright LEDs for automotive applications [ C ]. Proceedings of the 7th international conference on thermal, Mechanical and multiphysics simulation and experiments in micro - electronics and micro - systems ,2006:390 - 394.
3Zweben C. Ultrahigh - thermal - conductivity packaging materials [ C ]. Semiconductor thermal measurement and management symposium, 2005 : 168 - 174.
4Arik M, Weaver S. Chip scale thermal management of high brightness LED packages [ C ]. Fourth international conference on solid state lighting, proceedings of SPIE, 2004, 5530:214 - 223.
5Shatalov M, Chitnisa A, Yadav P et al. Thermal analysis of flip - chip packaged 280 nm nitride - based deep ultraviolet light - emitting diodes [ J ]. Applied physics letters, 2005,86(20) :201109.1 - 3.
6Hwu F S, Sheu G J, Chen J C. Thermal modeling and performance of LED packaging for Illuminating device [ C ]. Sixth international conference on solid state lighting, pro- ceedings of SPIE,2006,6337 (63371J) :J1 - J7.
7Culham J R,Khan W A ,Yovanovich M Met al. The influence of material properties and spreading resistance in the thermal design of plate fin heat sinks[ J]. Journal of electronic packaging, 2007,129 ( 1 ) :76 - 81.
8Weng C J. Advanced thermal enhancement and management of LED packages [ J ]. International communications in heat and mass transfer,2009,27 ( 3 ) : 35 - 39.
9Yen C H, Liu Y J, Huang N Y, Yu K H, Chen T P, Chen L Y, Tsai T H, Lee C Y, Liu W C 2008 IEEE Photon. Techn. Lett. 20 1923.
10Liu L, FanG H, Liao C J, Gao M D, Chert G C, Chen L H2003 Acta Phys. Sin. 52 1264 (in Chinese).
