触变型LED封装胶的制备

Preparation of Thixotropic LED Adhesive

分别以含氢硅油和含氢环体为原料,与1,2环氧-4-乙烯基环己烷通过硅氢加成制得两种环氧改性硅油(1和2)。通过转化率、环氧值以及红外光谱对环氧改性硅油进行结构表征。将其加入硅橡胶体系中,高速混合后,制得高触变性LED封装胶,并测试其硬度、挤出性、粘接性能和触变性能。结果表明,加入环氧改性硅油后,封装胶具有显著的触变性;当环氧改性硅油1与环氧改性硅油2质量比为2∶1、加入质量分数为2.5%时,得到触变型封装胶的粘接性及触变效果较佳,与空白样相比分别提高了150%、221%。

Two kinds of epoxy-modified polysiloxane （1 and 2） were prepared by hydrosilylation with hy-drogen silicone fluid and hydrogen ring as raw materials respectively , then reacted with 1 ,2-epoxy-4-vinyl al-kanes.Then the structures of epoxy-modified polysiloxane were characterized by conversion rate , epoxy value and FTIR.Epoxy-modified polysiloxane was added into silicone rubber with high-speed to get a high thixotrop-ic LED adhesive .The hardness , extrudability , adhesion and thixotropic properties of the adhesive were char-acterized after epoxy-modified polysiloxane were added .Results indicated the adhesive with epoxy-modified polysiloxane had significant thixotropy .When the mass ratio of epoxy-modified polysiloxane 1 and epoxy modi-fied polysiloxane 2 was 2∶1, and the added amount is 2.5%, the thixotropic packing adhesive had good adhe-sion and thixotropic effect .