有约束单一圆形片剪冲排样的递归算法

Recursive Algorithm for Generating Constrained Cutting Patterns for Wafers of a Single Size

为解决有约束单一圆形片剪冲排样问题,提出一种生成规范多级排样方式的递归算法。剪冲工艺首先采用剪床将板材剪切成条带,然后使用冲床将条带冲压出圆形片。算法使用水平剪切线和竖直剪切线从板材上剪切下条带;通过调用递归过程确定每次的剪切线方向和条带宽度;采用隐式枚举法缩小算法计算量。运用该算法开发了一个有约束单一圆形片排样系统。采用大量随机生成的测题进行实验,结果表明该算法在计算时间和板材利用率两方面都有效且生成的排样方式便于剪切。

In order to solve the constrained cutting patterns for wafer of a single size problem, it presents an recursive algorithm for generating normal muti-section patterns. In the shearing and punching process, first the sheet is cut into strips by a guillotine shear, and then the wafer blanks are cut from the strips by a stamping press. The algorithm uses horizontal shearing line and vertical shearing line to cut strips on the plate; each cutting line＇s direction and band＇s width is determined by calls the recursive procedure; uses implicit enumeration method to reduce the computation quantity of the algorithm Using the algorithm it develops a constrained single circular sheet layout system. Uses a large number of randomly tests to test the system, and the results show that the algorithm is efficient both in computing time and material utilization and also the generated pattern is convenient shear.