高导热耐高温型环氧灌封胶的制备与性能

Preparation and performance of epoxy potting sealant with high thermal conductivity and high-temperature resistance

以氮化硼为主填料,采用酚醛型环氧树脂与酸酐类固化剂,制备了一种高导热耐高温型环氧灌封胶。研究了填料用量与硅烷偶联剂改性对胶粘剂热导率与耐高温性的影响。结果表明,随着填料量的增加,热导率增强,但耐温性能有所降低。偶联剂的适量加入也增强了环氧胶的导热与耐温性能。

A epoxy resin potting sealant with high thermal conductivity and high temperature resistance was prepared with the novolac epoxy resin and anhydride curing agent, using the boron nitride （BN） micro particles as the basic packing. The result showed that with increasing the mass fraction of BN, the thermal conductivity of epoxy sealant was increased, however, its temperature resistance was decreased. The addition of right amount coupling agent enhanced the thermal conductivity and temperature resistance of epoxy potting sealant.