低温固化环氧灌注结构胶的研制

Development of epoxy filling structural adhesives curable at low temperature

研制了一种能低温固化的环氧灌注结构胶。研究发现,通过硫醇胺固化剂与自制改性胺固化剂并用,并加入活性稀释剂、填料以及偶联剂等,制得的环氧胶粘剂在低温和常温下的固化速度较为适中,对不锈钢、混凝土等基材的粘接性能较好。

A kind of low temperature curable epoxy filling structure adhesive was prepared. It was found that through combining the mercapto amine curing agent and the self-made modified amine curing agent and adding the reactive diluent, powder filler and a coupling agent, etc. the prepared adhesive had the moderate curing speed at low and room temperature. The adhesive had better bonding properties to stainless steel, concrete and other substrates.