摘要
随着发光二极管(LED)功率和亮度的不断提高,封装材料已成为制约LED进入照明领域的关键技术之一。综述了改性环氧树脂和有机硅LED封装材料的研究进展,并展望了改性环氧树脂和有机硅LED封装材料的发展前景。
With the improvement of light emitting diode brightness and efficiency, the preparation of the eneapsulants becomes an important key technique for LED lighting in daily life. The research progress of modified epoxy and silicone LED encapsulants is reviewed, and the development prospect of modified epoxy and silicone LED encapsulants is forecasted.
出处
《上海塑料》
2015年第2期6-10,共5页
Shanghai Plastics
基金
上海市科促会/教育基金会联盟资助(LM201317)
上海应用技术学院重点学科"复合材料"资助(10210Q140001)
